STMicroelectronics First to Use Through-Silicon Vias for Smaller and Smarter MEMS Chips
SEOUL--(Korea Newswire) October 19, 2011 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications, is the world’s first manufacturer to have implemented Through-Silicon Via technology (TSV) in high-volume MEMS production. TSV replaces traditional wiring with short vertical interconnects in ST’s multi-chip MEMS devices, such as smart sensors and multi-axis inertial modules, enabling a higher level of functional integration and performance in a smaller form factor.
TSV utilizes short, vertical structures to connect multiple silicon dice stacked vertically in a single package, offering greater space efficiency and higher interconnect density compared with wire bonding or flip chip stacking. Already deployed in volume production, the ST-patented TSV technology helps shrink the MEMS chip size while increasing its robustness and performance.
“There is a great demand for smaller packages in the consumer market. ST’s breakthrough implementation of TSV in MEMS devices opens a path to reduced footprints and increased functionality in mobile phones and other gadgets,” said Benedetto Vigna, Corporate Vice President and General Manager of ST’s Analog, MEMS and Sensor Group. “High-performance 3D-chip integration in our smart sensors and multi-axis inertial modules marks another important milestone in our mission to make MEMS ubiquitous in all facets of life.”
STMicroelectronics has a long history and expertise in high-volume production of MEMS sensors and actuators. Five years ago, ST launched the Consumer MEMS revolution by making motion sensors small, accurate and affordable through the combination of innovative product design, deep application expertise, and bold and timely infrastructure investments. More than 1.6 billion ST’s MEMS chips has been sold to date, addressing applications in Consumer, Computer, Automotive, Industrial and Medical segments.
+82 2 3489 0145
+82 2 3489 0145
- ST마이크로일렉트로닉스, 세계 최초 듀얼 코어 자이로스코프 출시
- ST마이크로일렉트로닉스, Dual interface EEPROM 이용 NFC 스마트폰과 전자기기의 통신 방법에 관한 웹캐스트 개최
- STMicroelectronics Reveals Advanced Automotive IC Moving Car Makers Closer To Toughest New-Car Environmental Targets
- ST마이크로일렉트로닉스, 가장 엄격한 자동차 환경 조건을 지원하는 첨단 자동차용 IC 출시
- Cisco Recognizes STMicroelectronics With Excellence in Quality Award