- Chipset enables automotive Ethernet-AVB for next-generation IVI and telematics
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Sample shipments of the TC9560XBG Ethernet bridge solution and TC9560AXBG, with CAN-FD features, start today, with volume production slated for October 2016.
Automotive electronics are becoming more complex with the addition of advanced sensors, high-resolution displays, on-vehicle cameras, automated driver assistance systems (ADAS), and their data transmission and controls. Connecting these devices with an industry-standard Ethernet protocol contributes to simplified wiring, cost savings, reduced harness weight and improved mileage. Toshiba’s new automotive-grade Ethernet solution also supports Ethernet-AVB, which is an important factor for multimedia applications. In addition, the device will be AEC-Q100 qualified to ensure performance in rigorous automotive environments.
Strategy Analytics forecasts that demand for automotive Ethernet will exceed 120 million nodes by 2020, driven by increased in- and on-vehicle electronic content, including cameras, sensors, displays, safety systems and convenience solutions. In particular, for emerging autonomous vehicle systems, a reliable, high-speed communications network is an essential requirement.
Connected to an application processor or other system-on-chip (SoC) host, the TC9560XBG allows the host device to deliver audio, video, and data information through the 10/100/1000 Ethernet network in an automotive environment. Connection to the host is achieved via PCI Express® (PCIe®), HSIC or Time Division Multiplex (TDM)/I2S for audio traffic. The IC’s RGMII/RMII interface connects to the Ethernet switch or PHY device, and both AVB and legacy traffic are supported. An on-chip ARM® Cortex®-M3 processor can perform system control and management.
The new chipset will be showcased at the 2016 International Consumer Electronics Show (CES), to be held from January 6 to January 9 in Las Vegas, U.S.A.
Main Specifications (To view the main specifications, please visit http://goo.gl/uNHnSO)
1. AEC-Q100 refers to the stress test qualification for ICs established by the U.S.-based Automotive Electronics Council, which sets qualification standards for all electronics components supplied to the automotive industry. Grade 3 refers to ambient operating temperature range of -40°C to +85°C.
2. “Automotive Ethernet Market Growth Outlook,” Strategy Analytics, Oct. 23, 2014.
3. Fast Ethernet interfaces: RGMII = Reduced Gigabit Media Independent Interface; RMII = Reduced Media Independent Interface. Support is planned for MII (Media Independent Interface).
*PCI Express and PCIe are registered trademarks of PCI-SIG.
*ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere.
For more information about the new product, please visit:
Automotive Sales and Marketing Department
*Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
Toshiba Corporation, a Fortune Global 500 company, channels world-class capabilities in advanced electronic and electrical product and systems into five strategic business domains: Energy & Infrastructure, Community Solutions, Healthcare Systems & Services, Electronic Devices & Components, and Lifestyles Products & Services. Guided by the principles of The Basic Commitment of the Toshiba Group, “Committed to People, Committed to the Future”, Toshiba promotes global operations and is contributing to the realization of a world where generations to come can live better lives.
Founded in Tokyo in 1875, today’s Toshiba is at the heart of a global network of over 580 consolidated companies employing 199,000 people worldwide, with annual sales surpassing 6.6 trillion yen (US$55 billion).
To find out more about Toshiba, visit www.toshiba.co.jp/index.htm
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