- LFPAK33 thermally-enhanced loss-free package delivers reliability and efficiency for next generation automotive subsystems
The Nexperia LFPAK33 package uses a copper clip design to reduce the package resistance and inductance which in turn reduces the RDS(on) and losses of the MOSFET. The resulting package has an ultra-compact footprint of 10.9 mm2, and because no wires or glue is used internally, operating temperatures of up to 175oC Tj max are possible. Devices can handle up to 70 A, and the extensive product portfolio includes devices that range between 30 V - 100 V and an RDS(on) as low as 6.3 mΩ.
“As more subsystems are crammed into cars the need for rugged, compact power systems is becoming ever greater,” said Richard Ogden, International Product Marketing Engineer at Nexperia. “This extension of our LFPAK portfolio provides designers with more product choices than anywhere else on the market today.”
Target applications include: connected auto modules, next generation engine management systems; chassis and safety technology; LED lighting; relay replacement; C2X, radar, infotainment and navigation systems; and ADAS. MOSFETS in the new LFPAK33 compact automotive power package are available now, visit http://www.nexperia.com/products/automotive-qualified-products-q100-q101/automotive-mosfets/family/LFPAK33/
Nexperia: Efficiency wins.
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