<?xml version="1.0" encoding="UTF-8"?><rss version="2.0"><channel><title><![CDATA[HyperLight 보도자료 - 뉴스와이어]]></title><link>https://www.newswire.co.kr/?md=A10&amp;act=article&amp;no=46389></link><description><![CDATA[HyperLight 보도자료 - 뉴스와이어 RSS 서비스]]></description><lastBuildDate>Thu, 30 Apr 2026 23:40:44 +0900</lastBuildDate><copyright>Copyright (c) 2004~2026 Korea Newswire All rights reserved</copyright><image><url><![CDATA[https://file.newswire.co.kr/data/upfile/company_img/2024/09/12_31017998_20240924093300_6217422353.png]]></url></image><language>ko-KR</language><item><title><![CDATA[HyperLight Introduces 400G-per-lane TFLN PICs on its Chiplet™ Platform for Next-Generation AI Interconnects]]></title><link>https://www.newswire.co.kr/newsRead.php?no=1030548</link><description><![CDATA[CAMBRIDGE, Mass.--(Business Wire/Korea Newswire)--HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptiona...]]></description><pubDate>Wed, 18 Mar 2026 14:55:00 +0900</pubDate></item><item><title><![CDATA[하이퍼라이트, 차세대 AI 인터커넥트를 위한 칩렛 플랫폼 기반 레인당 400G TFLN PIC 출시]]></title><link>https://www.newswire.co.kr/newsRead.php?no=1030551</link><description><![CDATA[케임브리지, 매사추세츠--(Business Wire/뉴스와이어)--TFLN 칩렛(TFLN Chiplet™) 플랫폼을 개발한 하이퍼라이트 코퍼레이션(HyperLight Corporation, 이하 ‘하이퍼라이트’)은 차세대 AI 네트워킹 인프라를 위해 설계된 레인당 400G 박막 리튬 나이오베이트(thin-film lithium niobate, TFLN) 광집적회로(photonic integrated circuits, PICs)의 출시를 발표했다. 이번 신규 PIC 제품군은 낮은 삽입 손실, 낮은 구동 전압, 그리고...]]></description><pubDate>Wed, 18 Mar 2026 14:55:00 +0900</pubDate></item><item><title><![CDATA[HyperLight Demonstrates Low-Power 1.6T-DR8 TFLN-based Reference Transceiver Assembled by TFC]]></title><link>https://www.newswire.co.kr/newsRead.php?no=1030406</link><description><![CDATA[CAMBRIDGE, Mass.--(Business Wire/Korea Newswire)--HyperLight Corporation (“HyperLight”) today announced a major milestone in low-power optical networking with the demonstration of a 1.6T-DR8 optical transceiver leveraging HyperLight’s TFLN Chiplet™ Platform.  The reference module was demonstrated with engineering and manufacturing support from Suzhou TFC Optical Communication Co., Ltd. (SZSE: 3...]]></description><pubDate>Tue, 17 Mar 2026 09:40:00 +0900</pubDate></item><item><title><![CDATA[하이퍼라이트, TFC가 조립한 저전력 1.6T-DR8 TFLN 기반 레퍼런스 트랜시버 시연]]></title><link>https://www.newswire.co.kr/newsRead.php?no=1030408</link><description><![CDATA[케임브리지, 매사추세츠--(Business Wire/뉴스와이어)--하이퍼라이트 코퍼레이션(HyperLight Corporation, 이하 하이퍼라이트)은 자사의 박막 리튬 나이오베이트 칩렛(TFLN Chiplet™) 플랫폼을 활용한 1.6T-DR8 광 트랜시버 시연을 통해 저전력 광 네트워킹 분야에서 중요한 이정표를 달성했다고 발표했다.  이 레퍼런스 모듈은 쑤저우 TFC 광통신(Suzhou TFC Optical Communication Co., Ltd., 선전증권거래소 300394, 이하 TFC)...]]></description><pubDate>Tue, 17 Mar 2026 09:40:00 +0900</pubDate></item><item><title><![CDATA[하이퍼라이트, 448Gbps 레인당 데이터 통신과 260GBaud 통신 개발 지원하는 145GHz 기준 변조기 출시]]></title><link>https://www.newswire.co.kr/newsRead.php?no=1030312</link><description><![CDATA[케임브리지, 매사추세츠--(Business Wire/뉴스와이어)--TFLN 칩렛(TFLN Chiplet™) 플랫폼을 개발한 하이퍼라이트 코퍼레이션(HyperLight Corporation)은 자사의 145GHz 패키지형 강도 변조기(Intensity Modulator, IM)를 출시했다고 발표하며 고속 변조기 포트폴리오를 확대했다. 이 새로운 장치는 초광대역 변조 대역폭, 높은 신호 충실도, 안정적인 동작 제어를 위해 설계되었으며, 레인당 448Gbps 강도 변조 직접 검출(intensi...]]></description><pubDate>Sun, 15 Mar 2026 11:42:53 +0900</pubDate></item><item><title><![CDATA[HyperLight Introduces 145 GHz Reference Modulators to Enable 448Gbps per Lane Datacom and 260GBaud Telecom Development]]></title><link>https://www.newswire.co.kr/newsRead.php?no=1030311</link><description><![CDATA[CAMBRIDGE, Mass.--(Business Wire/Korea Newswire)--HyperLight Corporation, creator of the TFLN Chiplet™  platform, today announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company's high-speed modulator portfolio. The new device is designed for ultra-wide modulation bandwidth, high signal fidelity, and stable operation control, enabling 448 Gbps per lane intens...]]></description><image><url><![CDATA[https://file.newswire.co.kr/data/datafile2/thumb/2026/03/1028147215_20260315113650_8370727223.jpg]]></url></image><pubDate>Sun, 15 Mar 2026 11:39:45 +0900</pubDate></item><item><title><![CDATA[HyperLight Launches 110GHz Intensity Modulator with Record low Vπ, Leveraging Its TFLN Chiplet™ Platform]]></title><link>https://www.newswire.co.kr/newsRead.php?no=1008277</link><description><![CDATA[CAMBRIDGE, Mass.--(Business Wire/Korea Newswire)--HyperLight, creator of the TFLN Chiplet™ platform, today announced the launch of its groundbreaking 110 GHz Low Vπ Intensity Modulator, featuring industry-standard optical fiber and microwave connectors. This industry-first device significantly advances electro-optic modulation capabilities for critical applications, including 400 Gbps-per-lane ...]]></description><image><url><![CDATA[https://file.newswire.co.kr/data/datafile2/thumb/2025/03/1028147215_20250327142410_6987511909.jpg]]></url></image><pubDate>Thu, 27 Mar 2025 14:35:00 +0900</pubDate></item><item><title><![CDATA[하이퍼라이트, TFLN Chiplet™ 플랫폼을 활용한 기록적으로 낮은 Vπ의 110GHz 광 모듈레이터 출시]]></title><link>https://www.newswire.co.kr/newsRead.php?no=1008278</link><description><![CDATA[케임브리지, 매사추세츠--(Business Wire/뉴스와이어)--TFLN 칩렛(TFLN Chiplet™) 플랫폼의 개발사인 하이퍼라이트(HyperLight)가 낮은 반파 전압(Vπ)의 획기적인 110GHz 광 모듈레이터를 출시한다고 발표했다. 이 제품은 업계 표준 광섬유 및 마이크로파 커넥터를 갖추고 있다. 업계 최초로 개발된 이 장치는 중요한 애플리케이션의 전기 광학 변조 기능을 크게 발전시킨 제품으로, 레인당 400Gbps 테스트, 100GHz+ 광 다이오드 ...]]></description><pubDate>Thu, 27 Mar 2025 14:35:00 +0900</pubDate></item><item><title><![CDATA[HyperLight Accelerates Growth With $37M Funding Led by Summit Partners]]></title><link>https://www.newswire.co.kr/newsRead.php?no=997257</link><description><![CDATA[CAMBRIDGE, Mass.--(Business Wire/Korea Newswire)--HyperLight Corporation, a leading provider of thin film lithium niobate (TFLN) photonic integrated circuits (PICs), today announced a US$37 million Series B investment led by Summit Partners. The round includes participation from existing investors Xora Innovation, a deep tech venture fund backed by Temasek, and Foothill Ventures. Peter Chung, M...]]></description><pubDate>Tue, 24 Sep 2024 09:49:24 +0900</pubDate></item></channel></rss>