<![CDATA[Resonac Corporation 보도자료 - 뉴스와이어]]>https://www.newswire.co.kr/?md=A10&act=article&no=46364>Tue, 21 Apr 2026 12:33:45 +0900Copyright (c) 2004~2026 Korea Newswire All rights reservedko-KR<![CDATA[Resonac Launches 27-Member “JOINT3” Consortium to Develop Next-Generation Semiconductor Packaging]]>https://www.newswire.co.kr/newsRead.php?no=1017978Wed, 03 Sep 2025 16:40:00 +0900<![CDATA[레조낙, 차세대 반도체 패키징 개발 위해 27개 회원사와 ‘JOINT3’ 컨소시엄 출범]]>https://www.newswire.co.kr/newsRead.php?no=1017979Wed, 03 Sep 2025 16:40:00 +0900<![CDATA[Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages]]>https://www.newswire.co.kr/newsRead.php?no=997117Fri, 20 Sep 2024 13:08:22 +0900<![CDATA[레조낙, 첨단 반도체 패키지를 위한 임시 본딩 필름 및 새로운 디본딩 공정 개발]]>https://www.newswire.co.kr/newsRead.php?no=997083Thu, 19 Sep 2024 18:05:19 +0900