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Samsung Ships Industry’s First Multi-chip Package with a PRAM Chip for Handsets

출처: 삼성전자 (코스피 005930)
2010-04-28 11:08

서울--(뉴스와이어) 2010년 04월 28일 -- Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced the industry’s first multi-chip package (MCP) with PRAM – for use in mobile handsets, beginning later this quarter.

The 512 megabit Samsung PRAM in the MCP is backward compatible with 40 nanometer-class* NOR flash memory in both its hardware and software functionality, allowing mobile handset designers the convenience of having multi-chip packaging fully compatible with past stand-alone PRAM chip technology. PRAM is expected to be widely embraced by next year as the successor to NOR flash in consumer electronics designs to become a major memory technology.

“Memories for portable consumer devices today are at a major turning point as mobile applications increasingly require more diverse memory technologies,“ said Dong-soo Jun, executive vice president, Memory Sales and Marketing, Samsung Electronics. “The launch of our PRAM in an advanced MCP solution for the replacement of 40nm-class and finer geometry NOR meets this need head-on. Our PRAM MCP will not only enable handset designers to utilize conventional platforms, but expedite the introduction of LPDDR2 DRAM and next-generation PRAM technology as the leading-edge basis for high-performance solutions,” he added.

PRAM, which stores data via the phase change characteristics of its base material, an alloy of germanium, antimony and titanium, provides three-times faster data storage performance per word than NOR chips. This new PRAM-packaged memory combines the nonvolatile nature of flash memory with the high-speed capability of DRAM. Its simple cell structure makes designing MCP chips for handsets a faster and easier process, with the imminent use of 30nm-class and finer process node technology to overcome long-time design difficulties inherent in NOR flash technology.

As a replacement for NOR, PRAM can more easily accommodate the growing demand for high-speed, high-density nonvolatile memory in mobile phones and other mobile applications such as MP3 players, personal multimedia players and navigational devices.

Samsung is continuing its research and development into PRAM and other advanced memory chips to enable faster ‘write’ capabilities, a key feature in taking photo images, providing multimedia messaging and recording video clips to reduce the standby time in data storage. This high-speed write capability will be important in a diverse span of digital storage and consumer devices, such as solid state drives (SSDs) and HDTVs.

About Samsung Electronics Co., Ltd.

Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2009 consolidated sales of US$116.8 billion. Employing approximately 188,000 people in 185 offices across 65 countries, the company consists of eight independently operated business units: Visual Display, Mobile Communications, Telecommunication Systems, Digital Appliances, IT Solutions, Digital Imaging, Semiconductor and LCD. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, memory chips, mobile phones and TFT-LCDs. For more information, please visit www.samsung.com.

삼성전자 개요
삼성전자는 반도체, 통신, 디지털 미디어와 디지털 컨버전스 기술을 보유한 글로벌 리더로, 2016년 200조원의 매출과 28조원의 영업이익을 달성했다. 전세계에서 9만6898명의 직원을 고용하고 있으며 세계 51개국에 90개가 넘는 오피스를 열고 있다. 삼성전자는 디지털 어플라이언스 부문, 디지털 미디어 부분, LCD부분, 반도체 부분, 통신 네트워크 부분 등 5개 부문으로 이루어져 있다. 세계에서 가장 빠르게 성장하는 브랜드인 삼성전자는 스마트폰, 디지털 TV, 메모리 반도체, OLED, TFT-LCD 분야에서 세계 선두 주자이다.

언론 연락처

Soojeong Lee
Samsung Electronics
+82-2-2255-8275
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