Samsung Improves Heat Dissipation in LCD TVs with New DDI Package

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삼성전자 코스피 005930

2007-02-01 11:17

Seoul--(뉴스와이어)--Samsung Electronics Co., Ltd., the leader in advanced semiconductor technology, announced that it has developed the industry’s first thermally-enhanced chip-on-film (TECOF) package for the display driver IC (DDI) used in large-screen, high-resolution LCD TVs. The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.

Demand for LCD TVs is surging with increased accessibility to digital broadcasting. At the same time, rapidly improving LCD TV performance has sparked explosive demand for full-high-definition models with a screen size of forty inches or larger.

A typical DDI requires at least 15 volts of power to drive these larger, higher-resolution LCD TV panels that operate on broader frequency spectrums to reproduce high-speed video images. As a result, the DDI generates greater heat, which can create reliability problems.

Samsung has developed a new material for the thin metal tape component that has the optimal properties for effectively maximizing heat dissipation. The company has also developed a new automated process for attaching the metal tape to the COF package. By applying Samsung’s new TECOF package, the thermal emissions from the DDI are quickly released via the metal tape, minimizing heat buildup.

In addition, heat build-up limits the number of channels a single DDI chip can cover, creating an obstacle to reducing the total number of DDI per panel. With the new TECOF package, the number of source DDIs for a full-HD LCD TV is reduced from fourteen 414 channel-DDIs to eight 720 channel-DDIs.

“Package technology has become an important element, along with circuit design, in the development of DDIs for large-screen LCD TVs.” Said Sa yoon Kang, vice president for Samsung’s System LSI Division. “With the development of TECOF package, we propose the new standard for DDI product and solidify our global leadership position in developing display driver ICs for the LCD market.”

Samsung has completed reliability testing of the new TECOF package and expects to ship its DDI product with the new TECOF package technology in the 2nd quarter of 2007. Samsung has maintained the top share of the global DDI market for the past five years.

About Samsung Electronics

Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2005 parent company sales of US$56.7 billion and net income of US$7.5 billion. Employing approximately 128,000 people in over 120 offices in 57 countries, the company consists of five main business units: Digital Appliance Business, Digital Media Business, LCD Business, Semiconductor Business and Telecommunication Network Business. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, memory chips, mobile phones and TFT-LCDs. For more information, visit www.samsung.com

삼성전자 개요
삼성전자는 반도체, 통신, 디지털 미디어와 디지털 컨버전스 기술을 보유한 글로벌 리더다. 삼성전자는 디지털 어플라이언스 부문, 디지털 미디어 부문, LCD 부분, 반도체 부문, 통신 네트워크 부문 등 5개 부문으로 이뤄져 있다. 세계에서 가장 빠르게 성장하는 브랜드인 삼성전자는 스마트폰, 디지털 TV, 메모리 반도체, OLED, TFT-LCD 분야에서 세계 선두 주자다.

웹사이트: http://www.samsung.com/sec