Santa Rosa platform set to hit product shelves in 1HMay, DRAMeXchange projects

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2007-03-28 18:05

Taiwan--(뉴스와이어)-----From a certain degree, Intel…s next generation NB platform--Santa Rosa, is expected to be the next driving force of the NB market after Vista. Some consumers, who have already delayed their NB purchase in anticipation of Vista…s release, are now waiting a little bit longer for the new system. Consequently, consumers will be able to buy an NB that is equipped with much newer hardware and software. According to the current product planning of vendors, if all goes as planned, Santa Rosa is set to hit product shelves in 1HMay. From the scheduled timetable, both the shipments of the full system or barebone NBs will be a major focus of PC ODMs at the end of April, says DRAMeXchange.

The major architecture of the Santa Rosa platform, as planned by Intel, is primarily equipped with the 64 bit dual-core Merom CPU, Crestline chipset, Kedron wireless module and so forth. Optional features include Robson, WWAN and the WiMax modules.

The upcoming Santa Rosa release in May will cover both the consumer and commercial sectors, and be equipped with the Core 2 Duo processor. For consumer models, they will essentially target the mid to high-end market, where they will mostly be installed with the new Windows Vista program. On the other hand, the commercial models will encompass all segments. However, the Vista bundle rate on commercial models will not be too high in the beginning. For the value consumer market, the launch of Intel…s 64 bit single-core CPU in 3Q07 should better accommodate the demand. By that time, the consumer Santa Rosa NBs should reach a new shipment peak.

As the NB industry has already turned into mature, the release of Santa Rosa is unlikely to bring forth explosive growth. However, the new features should create new business opportunities for related component manufacturers. Due to objective conditions and cost issues, some of the new features in the first batches of the Santa Rosa NBs will not be highly bundled. In terms of wireless chips, the 802.11 a/b/g should be the main standard in the beginning. If everything proceeds smoothly, the bundle rate of the 802.11n is projected to grow in 4Q07, and increase significantly in 2008. As the chip price for the Robson module is still expensive, the planned bundle rate will not be too high at the moment, where ODMs mostly offer Mini Card slot as a solution for optional buyers. Once the Robson chip prices drop to a more acceptable level (includes both the Flash and Intel chip), the rate is expected to increase, according to the firm.

웹사이트: http://www.DRAMeXchange.com