1HAug. NAND Flash contract price appears ups and downs with mixed market factors

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2009-08-11 13:16

Taipei--(뉴스와이어)--1HAug. mainstream MLC NAND Flash contract price appears ups and downs with mixed factors that some suppliers slightly adjusted down 2%-5% on some high-density MLC NAND Flash contract price to spur the demand since output portion of high-density products produced by more advanced process technologies (4xnm & 3xnm) is raised along with cost advantage. At the meantime, output portion of low-density products produced by more mature process technologies declines and some suppliers mildly adjusted up 5%~7% NAND Flash contract price on some low-density MLC chips. Says DRAMeXchange.

Despite of long-term restock orders from cellular and MP3 system customers in 3Q09, DRAMeXchange believes that memory card and UFD customers are still in the status of slow season in early August. However, the inventory replenishment for memory card and UFD products is expected to gradually recover staring from late August. Some suppliers will slightly increase the wafer output in 3Q09 and most suppliers will gradually raise the output portion of 3xnm process technology after August. It will result in the pressure of upward pricing trend for high-density chips. Combined with the above positive & negative market factors and quarter-end effect in coming September, DRAMeXchange expects NAND Flash market to roughly stay at a more balanced status in 3Q09. Nevertheless, NAND Flash suppliers will apply different pricing strategies depending on individual client base, order mix and process technology breakdown. Therefore, NAND Flash contract price may continue to demonstrate the mild ups and downs pattern or roughly stay stable in the short term.

웹사이트: http://www.DRAMeXchange.com