Samsung Develops 12 Megapixel CMOS Imager with 1.12um Back Side Illuminated Pixel Architecture for High–quality Imaging on Premium Feature and Smart Phones

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삼성전자 코스피 005930

2011-02-10 13:10

SEOUL--(뉴스와이어)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, today announced its new 12 Megapixel (Mp) CMOS imager using advanced 1.12 micron pixel technology. Based on the back side illuminated (BSI) pixel architecture, the 1/3.2-inch imager offers clear and sharp images in low light environments and is optimized for premium feature and smart phones.

“With extensive experience and technical knowhow in the image sensor business, we successfully developed the smallest, 1.12 micron pixel imager,” said Dojun Rhee, vice president of marketing, System LSI Division, Samsung Electronics. “With this achievement, we are committed to lead the market by providing high-quality products demanded by consumers and businesses.”

The S5K3L1 supports 12Mp full resolution images at 30 frames per second (fps) and 1080p full HD video at 60fps enabling crisp still photos and high-speed video recording, as well as 720p at 90fps and VGA resolution images at 120fps for slow motion playback function in mobile phones. The new image sensor also includes an on-chip pixel correction feature, compensating color and luminance response variations to address image distortion.

In addition, the 12Mp imager offers an optional RGB-white color filter array, which delivers advanced sensitivity while reducing noise, resulting in a 30 percent brighter image over that of a conventional RGB color filter array. The RGB-white filter feature works in conjunction with a complimentary logic chip (S5C73L1), which converts RGB-White pattern to RGB Bayer for back-end Bayer ISP compatibility. The logic chip also provides features such as lens shading correction, image down scaling, noise reduction and significantly enhanced modulation transfer function to reproduce fine details.

Samsung’s S5K3L1 imager is designed to address an 8.5mm x 8.5mm auto focus camera module with a height dimension of 6.0mm for slim mobile phones and small form factor applications

Samples of the 12Mp imager are available now with mass production scheduled in the third quarter of this year.

The S5K3L1 will be displayed at the Mobile World Congress, Barcelona, Spain from February 14 to 17.

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웹사이트: http://www.samsung.com/sec