Morfis Semiconductor Unveils Family of World’s Smallest Fully Integrated CMOS Single-Die Flip-Chip Cellular RF Front-Ends at CES 2016
Morfis Semiconductor’s Family of Products Meets And Exceeds GaAs Performance Levels Without the Need of Envelope Tracking (ET)
Morfis Semiconductor’s single-die CMOS architecture supports the cellular industry’s entire 2G/3G/4G LTE frequency bands without sacrificing efficiency or linearity.
At CES 2016, Morfis will showcase its latest breakthroughs and demonstrate its game-changing, fully integrated CMOS MMMB PAs and RF front-ends based on its proprietary and patented technology.
Samples are available today for alpha customers, with mass production scheduled to start in Q2 2016.
About Morfis Semiconductor, Inc.
Morfis Semiconductor, based in Irvine, Calif., is a leading fabless developer of fully integrated, single-chip, single-die RF front-end solutions.
View source version on businesswire.com: http://www.businesswire.com/cgi-bin/mmg.cgi?eid=51241853&lang=en
Website: http://www.morfsemi.com
Contact
Morfis Semiconductor, Inc.
Michael Lee
Director, Strategic Marketing
949-656-8890
marketing@morfsemi.com
This news is a press release provided by Morfis Semiconductor, Inc.. Korea Newswire follows these editorial guidelines.
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2016년 2월 22일 17:35