Samsung Electronics Raises the Bar for High Density Flash Memory-Embedded Smart Card ICs
The new SIM card IC will be demonstrated in Booth Hall 3 no.3 C029 at the CARTES 2005 exhibition held at Paris, France from November 15 through 17.
The speed and reliability of user identification in the S3FJ91L is guaranteed by ARM-based 32bit SC200 Secure Core, a 3-DES encryption standard and a PKI crypto processor. Its fortified anti-hacking technology significantly reduces the risk of personal information leakage.
Samsung’s S3FJ91L IC has a built-in 16KB Static RAM to enable easy upgrades and the introduction of various applications by software developers.
A Java Accelerator also improves the speed and makes it easier to implement Java-based platforms.
The S3FJ91L supports an operating voltage from 1.62V to 5V. Such low power requirement is compatible with power consumption requirements of the GSM standard. In addition, data programming and updating processes operate independently with one another, making memory management easier and more efficient.
For the first time in the smart card industry, Samsung’s new IC is manufactured on a 300 mm wafer fab, gaining global competitiveness in terms of cost. The new IC will be applied to various smart cards such as USIM and UIM cards for GSM, GPRS and IMT2000 as well as JAVA and multimedia cards. With the introduction of the new S3FJ91L, Samsung has now established a full line of smart card ICs with embedded memory from 96KB to 2MB.
The market research company, iSuppli, forecasts that the fast-growing smart card market demand will reach 1 billion units this year and surpass 1.6 billion units by 2008.
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웹사이트: http://www.samsung.com/sec
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