Teledyne DALSA Announces MEMS Integrated Design for Inertial Sensors (MIDIS(TM)) Platform
- High performance, low-cost inertial sensor platform for consumer, automotive and sports/health applications
“Our MIDIS™ platform is a break-through technology that greatly reduces time to market by using a standardized process, rather than developing each new device from the ground-up, while making no compromises in performance,” said Donald Robert, VP of Marketing at Teledyne DALSA Semiconductor. “Our high performance Through Silicon Via (TSV) and wafer bonding approach provides high vacuum and hermeticity, without the need for expensive getters, in a very compact wafer level package.”
Key Features and Benefits
-- Low product cost achieved by reduced die size and elimination of getter
-- Standardized process reduces time to market, cost and development time
-- High vacuum and hermeticity allows resonator Q factors greater than 20,000
-- Efficient wafer level packaging minimizes overall die size
-- Comprehensive design rules maximize yield and reliability
Sensors fabricated using Teledyne DALSA's MIDIS platform are already sampled or in production with alpha customers and the platform is now being made available to the general market. For more information, contact sales.semi@teledynedalsa.com. To learn more about the MIDIS platform, visit our website at www.teledynedalsa.com/midis.
Webcast: Introducing MIDIS
Interested in learning more about the MIDIS platform? Register for our live webcast, which will take place on June 27, 2013. During the webcast, Luc Ouellet, VP of Technology Development at Teledyne DALSA Semiconductor and Laurent Robin, Technology & Market Analyst for Inertial MEMS Devices & Technology at Yole Developpement will explain the finer points of this breakthrough new platform and the exciting possibilities it enables for consumer device designers.
About Teledyne DALSA Semiconductor
Located in Bromont, Quebec, Canada, Teledyne DALSA's award winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs, and high voltage CMOS. As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs. For more information, visit www.teledynedalsa.com/semi.
About Teledyne DALSA, Inc.
Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing MEMS products and services. For more information, visit www.teledynedalsa.com.
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Teledyne DALSA reserves the right to make changes at any time without notice.
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Website: http://www.teledynedalsa.com
Contact
Media Contact
Teledyne DALSA
Heather Neale
+1-514-333-1301 ext. 4227
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2023년 12월 1일 09:05
